AOI Optical Inspection System

Date：2026/02/26Click：

1. Inspection Items Process quality of solder paste printing, placement process, post-reflow, and post-wave soldering

2. Inspection Methods Comprehensive weighted imaging data difference analysis technology, color image comparison, color extraction analysis technology, similarity, binarization, OCR/OCV, solder ball detection, pin analysis and other algorithms comprehensive application

4. Recognition Features Three MARK positioning correction, CAD import automatic compensation

5. Inspection Coverage A Solder paste printing: Presence/absence, skew, insufficient/excess solder, open circuit, contamination;
Component defects: Missing part, offset, tilt, tombstone, side stand, flipped part, wrong part, damage, reverse polarity;
Solder joint defects: Excess solder, insufficient solder, bridging, copper foil contamination, etc. (Complies with RoHS lead-free soldering inspection requirements);
B Wave soldering inspection: Excess solder, insufficient solder, short circuit, wrapped solder, pinholes

6. Camera All-digital high-speed CCD color 5-megapixel camera, Resolution: 15μm

7. Light Source RGBB four-element three-color ring LED structure light source, special auxiliary coaxial light source

8. Platform Drive Device AC servo motor system, camera moves in XY direction

9. Conveyor System Board fixing method: bottom-up fixing, pogo pin function can correct large board warpage. Automatic board in/out and automatic width adjustment system, compliant with SMEMA standard

10. Conveyor Height from Floor 900±20mm

11. XY Platform Movement Speed 500mm/s

12. XY Platform Positioning Accuracy <10μm

13. PCB Dimensions 50x50mm ～ 400x330mm

14. PCB Thickness 0.3～3.0mm (Warpage ≤2mm, with fixture auxiliary correction system)

15. Minimum Component 15μm (CHIP:01005, Pitch:0.3mm)

16. Component Height Above PCB ≤30mm; Below PCB ≤30mm

1. Inspection Items	Process quality of solder paste printing, placement process, post-reflow, and post-wave soldering
2. Inspection Methods	Comprehensive weighted imaging data difference analysis technology, color image comparison, color extraction analysis technology, similarity, binarization, OCR/OCV, solder ball detection, pin analysis and other algorithms comprehensive application
4. Recognition Features	Three MARK positioning correction, CAD import automatic compensation
5. Inspection Coverage	A Solder paste printing: Presence/absence, skew, insufficient/excess solder, open circuit, contamination; Component defects: Missing part, offset, tilt, tombstone, side stand, flipped part, wrong part, damage, reverse polarity; Solder joint defects: Excess solder, insufficient solder, bridging, copper foil contamination, etc. (Complies with RoHS lead-free soldering inspection requirements); B Wave soldering inspection: Excess solder, insufficient solder, short circuit, wrapped solder, pinholes
6. Camera	All-digital high-speed CCD color 5-megapixel camera, Resolution: 15μm
7. Light Source	RGBB four-element three-color ring LED structure light source, special auxiliary coaxial light source
8. Platform Drive Device	AC servo motor system, camera moves in XY direction
9. Conveyor System	Board fixing method: bottom-up fixing, pogo pin function can correct large board warpage. Automatic board in/out and automatic width adjustment system, compliant with SMEMA standard
10. Conveyor Height from Floor	900±20mm
11. XY Platform Movement Speed	500mm/s
12. XY Platform Positioning Accuracy	<10μm
13. PCB Dimensions	50x50mm ～ 400x330mm
14. PCB Thickness	0.3～3.0mm (Warpage ≤2mm, with fixture auxiliary correction system)
15. Minimum Component	15μm (CHIP:01005, Pitch:0.3mm)
16. Component Height	Above PCB ≤30mm; Below PCB ≤30mm