SETEC S8030 SPI Solder Paste Inspection Tester

Date：2026/02/26Click：

1. Measurement Principle	Programmable Phase Modulation Profilometry (PSLM PMP)
2. Measurement Items	Volume, Area, Height, XY Offset, Shape, etc.
3. Defect Types Detected	Insufficient/Excess Solder, Missing Print, Bridging, Misalignment, Shape Defects, Board Contamination, etc.
4. Camera Configuration	4MP Ultra-High Frame Rate Industrial Camera, Pixel Size 15μm
5. Accuracy	10μm; Height: <1μm
6. Height Repeatability	<1μm (4 Sigma)
7. Volume Repeatability	<1% (4 Sigma)
8. Solder Paste Repeatability	Gage R&R <10%
9. Inspection Speed	0.45 sec/FOV
10. Illumination Light Source	2D Red/Green/Blue (R/G/B), 3D White
11. Mark Point Detection Time	0.3 sec/pcs
12. Maximum Measurement Height	±350μm
13. Maximum Measurement Height for Bent PCB	±5mm
14. Minimum Pad Pitch	100μm
15. Minimum Measurement Size	Rectangle: 150μm; Circle: 200μm
16. PCB Dimensions	50×50 - 330×250 mm
17. PCB Thickness	0.4 - 5 mm
18. PCB Weight	0 - 3 kg
19. PCB Conveyor Height	900 ± 40 mm
20. SPC Statistics	✔️ Supported
21. Coordinate Data Import	Supports Gerber Data 274D/274X format, Manual Teach Mode CAD X,Y,Part, etc.

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